Name	High temperature resistant electronic components encapsulating adhesive（THO4054）
Outline	This double-component product is epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well. No bubbles appear after curing thus making the surface smooth and bright. The series has two categories, room temperature curing and heat curing. Its viscocity, color and heat-resistance quality are adjustable.
Applications	It applies to the encapsulating electronic components and chips in transformers, rectifiers, AC capacitor, ignition coils, electronic modules, negative ion generator, atomizer, and other products to protect them against moisture, chemicals, excessive heat, vibration, mechanical impact and thermal shocks.
Features	Component A is pasty, non-solid particle. component B is in tinted paste shape. Fast curing velocity. At 25°C, within 1-3 hours, it is at the early stage of curing, 12 hours later, it reaches its maximum bonding strength. Being durable and resistant to ultraviolet light once the bond has formed. Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature. Mix the two components in a certain proportion, apply it to the surface of the substrates directly, which makes it so convenient to use. You.ll get long term durability and resistance to moisture, chemicals, oils, and temperature extremes. Non-toxic after solidification, though it is a little smelly. Being stable, its storage time is one and a half year. The main technical parameters are as follows: Heat resistance scope：-40°C—+ 380°C volume resistance: 1×10×15Ω.cm sheet resistance   2.5×1015Ω voltage withstand  20-24kV/mm         hardness  shore D 90 Water absorbing capacity 24h＜0.1%     Tg:300-400℃ Cementation intensity:   Tensile strength≥25MPa; Shearing strength≥20 MPa
Instruction	1. To get the best results, the two surfaces being bonded should be free of oils, dirt, moisture and other contaminants and should be slightly roughed or sanded to remove gloss. 2. Mix A and B in a proportion of 10:1.2--1.5 to get perfect bonding result at fastest speed at 25 °C. 3. Spread the mixture on the substrates, put them together and apply some strength on them, finally, let them dry for 2-4 hours.
Notes	1.The tools used to get adhesives should have exclusive usage. 2. It is necessary to keep it well ventilated and away from fire . 3.If it has contact with skin, you should wash thoroughly with soap and water. 4. It can be stored at well-ventilated places with low temperature, and keep them away from fire. Cover the lip after using it.