Name	High temperature resistant chips potting adhesive（THO4062）
Outline	Being temperature and aging resistant, this one-component epoxy modified adhesive cures fast at room temperature. It is the best choice for researching and developing chips.
Applications	It is applicable to the bonding, filling and sealing of metal chips, chip ceramic composite, composite materials (PCB) chips working under high temperature situations, underwater or other situations. It also applies to the restoration, encapsulation of electronic components and bonding of heated parts.
Features	it is white or transparent thick liquid, having no solid particles. Fast curing speed. It solidifies within 60 minutes at 100℃ and it reaches its maximum bonding strength 1 day after its cooling. Being durable and resistant to ultraviolet light, once the bond has formed. Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature. Mix the two components in a certain proportion, apply it to the surface of the substrates acquiring no strict treatment, which makes it so convenient to use. You.ll see long term durability and resistance to moisture,chemicals,oils and temperature extremes. Non-toxic after solidification, though it is a little smelly. Being stable, its shelf life is 6 months. The main technical parameters are as follows: Heat resistance scope：--45°C－+400 °C   Cementation intensity:   Normal temperature: Tensile strength≥25MPa;   Shearing strength≥21.6 MPa      At 150°C: Tensile strength  2.75－4.65 MPa
Instruction	1. Clean the surface of the material, make sure they have no dust or oil on them, wait until they are dry. 2. Spread the mixture on the substrates, put them together and apply some strength on them, heated it and let it dry
Notes	1. Better to keep the working place well ventilated. 2 .If it has contact with skin, you should wash with soap.   3. It can be stored at well-ventilated places with low temperature, and keep them away from fire. Cover the lip after using it.