Question: Some customers don’t know how to apply our adhesives, hence, we have some suggestions on initial treatment of the substrates.

 

1. When we bond alloy to alloy, acid treatment of the substrates in the hydrochloric acid

of 37% thickness is recommended. During the process of acid cleaning, we should take care that the acid liquid won’t splash onto our skin and we should also keep the working place well-ventilated.

2. We can use sand paper to sand the substrates of the metals if the substrates are not finely treated.

3. When we bond copper to copper, we can have acid treatment in the HCL

of 37% thickness, never thick H2SO.

4. When we bond metals to other materials, we’d better have both substrates treated so as to get the best bonding strength.

5. When we bond ABS materials, it is better to sand the surface of the materials so as to get the best bonding strength.

6. When we bond metals to silastic, it is highly suggested that the parting treatment of the silastic surface be of necessary.

7. When we bond plated metals, we should strip away the electroplated layer because of its low strength.